12-layer communication server board, high density to reduce cost for customers by more than 20000 pins.
24-layer backplane with 10.125G high-speed signals, using back drilling, buried vias, and other processes, with over 10,000 pins.
18-layer board, high-speed AD acquisition, more than 10000 pins.
The company has 4 automated assembly production lines, which can meet the large-scale assembly production requirements of various electronic products. The assembly process is equipped with a large number of automated equipment, including automatic chip programming burners, LCD pulse welding machines, ultrasonic welding machines, hot melt riveting equipment, laser coders, and automatic screw machines, which can provide customers with software downloads, finished product assembly, and full packaging services. In order to ensure the consistency of product quality, a complete set of quality control equipment such as ICT, FCT, PCBA functional testers, measuring instruments, and laboratories are configured. The production process is equipped with various process quality monitoring equipment and facilities, including electric batch torque calibration instruments, test software flag management, to prevent defective products from entering the next process.
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